NICLAFOR 1000
CuNi9Sn6
Cu reste Ni8.5-9.5 Sn5.5-6.5
Chemical composition |
---|
CuBAL
Ni8.5-9.5
Zn0.5 max
Pb0.02 max
Sn5.5-6.5
Fe0.5 max
Mn0.05-0.30
Mg0.15 max
OtherNb 0.1 max
Alloy name | |
---|---|
RLSA no. | 560 |
EN standard | |
DIN standard | |
UNS no.* | C72700 |
*Unified Numbering System (USA)
Characteristics and main uses
Niclafor 1000® is a Copper-Nickel-Tin (CuNi9Sn6) based alloy with high strength and low thermal conductivity. The high strength and excellent resistance to thermal relaxation are derived from spinodal decomposition. The combination of strength and formability is similar to that of beryllium copper and titanium copper alloys.
Main uses
Electronics industry uses CuNi9Sn6 for springs, miniaturized signal connectors and EMI shields.
Additionally, the high strength allows Niclafor 100 to be used in eyeglass arms and hinges as well as mechanical components in wristwatches.